Compare |
Mfr Part # |
RoHS |
Inventory |
Description |
Package |
|
Quantity |
Part Status |
---|---|---|---|---|---|---|---|---|
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HSET930-BGA-2
iBASE Technology |
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22047 | HEAT SPREADER FOR ET930 (H051HSE | Box | - | Active | ||
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575102B00000G
Aavid, Thermal Division of Boyd Corporation |
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52128 | Heat Sink TO-220 Aluminum 1.0W @ 20°C Board Level | Bag | - | Active | ||
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530400B00100G
Aavid, Thermal Division of Boyd Corporation |
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60042 | Heat Sink TO-220, TO-218 Aluminum 4.0W @ 30°C Board Level, Vertical | Bulk | - | Active | ||
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502006B00000G
Aavid, Thermal Division of Boyd Corporation |
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71772 | Heat Sink TO-66 Aluminum 7.0W @ 50°C Board Level | Bulk | - | Active | ||
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HSIB899-BGA-A
iBASE Technology |
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24816 | AC, HEATSINK FOR IB899 SERIES, ( | Box | - | Active | ||
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591202B04000G
Aavid, Thermal Division of Boyd Corporation |
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71049 | Heat Sink TO-220, TO-262 Aluminum 1.0W @ 40°C Board Level, Vertical | Bulk | - | Active | ||
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HSIB898-BGA-1
iBASE Technology |
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22968 | AC, HEAT SPREADER FOR IB898, (RO | Box | - | Active | ||
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HSE-B508-045H
CUI Devices |
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54886 | Heat Sink TO-220 Aluminum Alloy 9.3W @ 75°C Board Level, Vertical | Box | - | Active | ||
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HSIB906-BGA-3
iBASE Technology |
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21496 | AC, HEAT SPREADER FOR IB906F-1G, | Box | - | Active | ||
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530714B05300G
Aavid, Thermal Division of Boyd Corporation |
![]() |
54883 | Heat Sink TO-220 Aluminum 2.0W @ 40°C Board Level | Bulk | - | Active | ||
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592502B00000G
Aavid, Thermal Division of Boyd Corporation |
![]() |
Inventory |
Heat Sink TO-220 Aluminum 1.5W @ 40°C Board Level | Bulk | - | Active | ||
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574802B03300G
Aavid, Thermal Division of Boyd Corporation |
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79268 | Heat Sink TO-220 Aluminum 3.0W @ 60°C Board Level, Vertical | Bulk | - | Active | ||
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HSS-B20-NP-13
CUI Devices |
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85431 | Heat Sink TO-220 Aluminum 3.9W @ 75°C Board Level | Bag | - | Active | ||
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591302B02800G
Aavid, Thermal Division of Boyd Corporation |
![]() |
72836 | Heat Sink TO-220, TO-262 Aluminum 1.0W @ 30°C Board Level, Vertical | Bulk | - | Active | ||
![]()
576802B03300G
Aavid, Thermal Division of Boyd Corporation |
![]() |
99220 | Heat Sink TO-220, TO-262 Aluminum 1.0W @ 30°C Board Level, Vertical | Bulk | - | Active | ||
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780752F00000G
Aavid, Thermal Division of Boyd Corporation |
![]() |
8949 | Heat Sink Aluminum Board Level, Vertical, Extrusion | Box | - | Active | ||
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HSE-B381-045H
CUI Devices |
![]() |
55496 | Heat Sink TO-220 Aluminum Alloy 9.9W @ 75°C Board Level, Vertical | Box | - | Active | ||
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652452F00000G
Aavid, Thermal Division of Boyd Corporation |
![]() |
21571 | Heat Sink Aluminum Top Mount, Extrusion | Box | - | Active | ||
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506902B00000G
Aavid, Thermal Division of Boyd Corporation |
![]() |
Inventory |
Heat Sink TO-220 Aluminum 1.0W @ 20°C Board Level | Bulk | - | Active | ||
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375024B00032G
Aavid, Thermal Division of Boyd Corporation |
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71361 | Heat Sink BGA Aluminum 2.0W @ 30°C Top Mount | Bulk | - | Active | ||
![]()
HSIB899-BGA-1
iBASE Technology |
![]() |
28863 | AC, HEAT SPREADER FOR IB899, (RO | Box | - | Active |